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Cover Story: Malaysia’s bid to become advanced packaging hub - The Edge MalaysiaThe Edge Malaysia · Thu, 06 Aug 2026 06:00:00 GMTCover Story: Pentamaster positions itself for the next cycle in advanced packaging - The Edge MalaysiaThe Edge Malaysia · Thu, 06 Aug 2026 06:00:00 GMT[News] ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027 - TrendForceTrendForce · Fri, 31 Jul 2026 03:28:10 GMTTSMC moves in on Intel's Turf with EMIB-like packaging tech, challenging a key foundry edge - FirstpostFirstpost · Thu, 30 Jul 2026 07:00:00 GMT