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TSMC reportedly develops EMIB-like packaging with Kinsus to prevent potential customer shift to Intel - dqindia.comdqindia.com · Wed, 05 Aug 2026 09:30:37 GMT[News] NVIDIA RTX 50 Prices in Korea May Rise Up to 30% From Aug. on Higher TSMC Wafer and GDDR7 Memory Costs - TrendForceTrendForce · Tue, 04 Aug 2026 10:12:47 GMT[News] CXMT Reportedly Eyes Second Beijing 12-inch DRAM Fab; HP, Asus, and Acer Said to Begin Limited Use - TrendForceTrendForce · Tue, 04 Aug 2026 07:10:04 GMT[News] PSMC Reportedly Becomes Intel’s Exclusive EMIB Silicon Capacitor Supplier; UMC May See Order Boost - TrendForceTrendForce · Tue, 04 Aug 2026 04:07:10 GMT[News] SK hynix, SanDisk Debut HBF Standard to Challenge AI Memory Bottlenecks with Google, Tenstorrent Support - TrendForceTrendForce · Tue, 04 Aug 2026 03:21:49 GMT[News] Across-the-Board 30% Price Hike: MLCC Price Surge Intensifies - TrendForceTrendForce · Tue, 04 Aug 2026 01:04:41 GMTTSMC is developing an advanced AI semiconductor packaging technology, which it internally calls 'quasi-EMIB,' and it may be similar to Intel's Embedded Multi-die Interconnect Bridge technology. - GIGAZINEGIGAZINE · Fri, 31 Jul 2026 12:00:00 GMTTSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance - TradingViewTradingView · Fri, 31 Jul 2026 08:54:58 GMT