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Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies - Tom's HardwareTom's Hardware · Thu, 06 Aug 2026 13:11:09 GMTSanDisk to Showcase HBF and Other AI Inference NAND Technologies at FMS 2026 - thelec.netthelec.net · Thu, 06 Aug 2026 12:27:00 GMTSandisk showcases NAND innovation for the era of AI inference at FMS 2026 - TahawulTech.comTahawulTech.com · Thu, 06 Aug 2026 08:21:25 GMTSamsung unveils 400-Layer V-NAND and next-generation AI memory technologies - newelectronics.co.uknewelectronics.co.uk · Thu, 06 Aug 2026 07:53:45 GMTSamsung Electronics wins 2 awards at intl. chip conference - The Korea HeraldThe Korea Herald · Thu, 06 Aug 2026 00:44:23 GMTSamsung reveals next-gen memory with stacked HBM and 400-layer NAND - TechSpotTechSpot · Wed, 05 Aug 2026 18:17:00 GMTSamsung Tackles the Memory & Storage Wall With 400+ Layer “Hybrid Bonded” V10 BV-NAND & zHBM That Stacks HBM Directly On Top of AI Chips - WccftechWccftech · Wed, 05 Aug 2026 16:50:04 GMTSamsung AI Memory: New V-NAND Targets AI Growth - AirGuide BusinessAirGuide Business · Wed, 05 Aug 2026 13:20:51 GMT