Latest news
FMS 2026 Signals the Next AI Memory War: Tiered Memory, zHBM, and Advanced Packaging - semivisionsemivision · Sun, 09 Aug 2026 07:53:48 GMTWhose Memory Is It? Building Multi-Tenant, Multi-Tier Memory for AI Agents (Part 1) - HackerNoonHackerNoon · Sat, 08 Aug 2026 19:02:31 GMTThe Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’ - SK hynixSK hynix · Fri, 07 Aug 2026 09:06:58 GMTMicron: Memory Now Nearly 50% of System Value, AI Agent Demand in 'Preseason Warm-Up' Phase - finance.biggo.comfinance.biggo.com · Fri, 07 Aug 2026 01:56:00 GMTSK hynix and Sandisk Unveil First HBF Standard, Supporting Up to 512GB Capacity - thelec.netthelec.net · Tue, 04 Aug 2026 22:57:10 GMTSamsung’s zHBM Places Memory on Top of AI Chips; BV-NAND Shatters 400-Layer Barrier - Tech TimesTech Times · Tue, 04 Aug 2026 20:58:28 GMTSK hynix, Sandisk set first HBF standard for AI memory - The Korea HeraldThe Korea Herald · Tue, 04 Aug 2026 05:27:11 GMTSK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at ‘FMS 2026’ - SK hynixSK hynix · Tue, 04 Aug 2026 04:41:32 GMT